Telecom & Communications

Thermacore has a variety of solutions to meet your cooling challenges at the component, board and system level.

Component level solutions - heat pipe assembly coupled to heat generating component via an interface plate to which the heat pipe and condenser fins or block are attached.

Board level solutions – thermal solution coupled to multiple heat generating components typically on a printed circuit board.

System level solutions – thermal solution typically coupled to an enclosure containing multiple components and/or boards.

Our communications-based solutions are capable of cooling equipment in the following product areas:

• Base Stations
• Amplifiers
• Enclosures
• Optical  

The Telecom market is a competitive one where competition and volumes often require a keen understanding of production and manufacturing efficiencies. Thermacore has developed its internal machining capabilities such that higher volumes can be met whilst keeping overheads low. Nevertheless, technical innovation and thermal development is still applicable, especially when combined with Thermacore's ability to focus on a strictly costed solution.

This would typically involve a mini PC with dedicated software and support silicon in the consumer retail space. Due to the marketing model, cost was a prime concern as was heat dissipation. With quantities in the tens of thousands a month, both criteria were time and cost critical.

The solution Thermacore Europe developed was correct to spec and supplied in time to allow a critical Christmas launch.

This project demonstrates the partnership that evolved allowed for tight time-scales to be met under pressure while maintaining quality and thermal performance.