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The cooling strategies used in current electronic equipment cabinets
are reaching a thermal ceiling. New solutions will be required as
higher power systems are developed. In view of the variety of system
architecture it is unlikely that a single "One Size Fits All"
solution will be feasible. Thermacore therefore have a technology
roadmap that manages the technology development risks whilst addressing
the different thermal challenges.
For
customers developing equipment that is based on an existing
architecture but requires a more sophisticated cooling solution
a Two Phase board level solution is possible.
In this design a copper evaporator is mounted directly to the
high heat flux components. Small diameter Heat Pipes or Thermosyphons
transport the heat to a fin stack. The geometry of the board
and the area dedicated to the fin stack would enable power levels
of 100 to 150 watts per board to be handled.
Attempts to handle similar power levels with conventional discreet
heat sinks would be impractical. This entry into Two Phase cooling
is particularly attractive because with the exception of the
dedicated real estate used to accommodate the fin stack, little
else about the system changes. |
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The
next logical step is to consider the cooling of an entire shelf,
Sub-Rack. Or indeed an entire rack.
To accomplish this a mechanism capable of passing heat from
each of the individual Boards or slide in units into the shelf
itself needs to be considered.
Similar to the Board level solution heat is transported by two-phase
devises to a single collection point on the board. When the
board is inserted into the shelf this heat is passed into a
second Two phase loop Thermosyphons system via a thermal transfer
connector and on to a condenser system where it will give up
its heat, returning to the liquid phase to recycle.
The condenser system can be either air or liquid cooled and
can be mounted at Shelf, Sub-Rack or Rack level. Power levels
of greater than 300 watts per board are possible.
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The
critical, component in achieving this Two Phase integration
is a Thermal Transfer Connector.
This connection must create an interface between the Two-phase
system on the board and the Two Phase system on the rack with
the minimum delta T whilst enabling the board to be removed
and inserted a high number of times. |
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